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Hong Kong Pavilion in 中國國際信息通信展覽會 (PT EXPO)

September 27 - September 30

Announcement: Invitation for submitting exhibits to

Hong Kong Pavilion in 中國國際信息通信展覽會 (PT EXPO), 27-30 September 2017

Hong Kong Federation of Invention and Innovation (HKFii) and Hong Kong Productivity Council (HKPC) are coordinating a government funded BUD project which aims to strengthen the capability of local inventors and enhance opportunity of local invention and innovative ideas towards successful business in domestic market.

 

WTIA is the supporting organization of the project. I am writing to invite you to join/submit your patented products/ solutions to the HK Pavilion in中國國際信息通信展覽會 (PT EXPO) in Beijing, 27-30 September 2017.

 

Key information of the exhibition is summarized as below:

Date: 27 – 30 September 2017 (Wed-Sat)

Venue: China National Convention Center, Beijing. ( 北京 · 国家会议中心)

Fee: Free of Charge

(The selected 40 patented products/ solutions form the applicants would be displayed in the HK pavilion for free.)

(Exhibitors need to pay for their own expenses including round-trip air tickets and hotel accommodation etc. if they would like to send their staff to the exhibition.)

Size of Showcase & Poster:

Showcase: 0.5mW x 0.5mD x 1mH​​

Poster: 1mW x 1.2mH

Related Theme:  Future Network, Cloud and Data, IoT, IoV, Innovative Life, Smart World, AR/VR, Smart City, FinTech, Information Security

 

Why should you join the HK Pavilion in PT EXPO?

  1. Free of charge for the selected patent/product
  2. Allowing investors/ distributors know more about your Patent & Product
  3. To find potential business and investment partners to explore licensing, manufacturing, marketing,

distribution, business cooperation opportunities, etc. in Chinese Mainland

  1. Business matching with potential collaborators
  2. Grasp plenty of free-of-charge exposure opportunities

 

More details of the exhibition can be found in our project website:

https://hkfii-bud-patent.wixsite.com/project-website/exhibitions

 

Application Deadline: 18 August 2017

 

How to submit the application?

Fill in the application form and submit to project officers by mail or by Fax: +852 2788 5405.

 

Mailing Address:

AED, Hong Kong Productivity Council

4/F, HKPC Building, 78 Tat Chee Avenue

Kowloon, Hong Kong SAR

Attn.: Mr Bill YEUNG

Tel: (+852) 2788 5869

 

Scan copy by email to: hkfii.bud@gmail.com is appreciated.

Details

Start:
September 27
End:
September 30
Event Category:
Website:
https://hkfii-bud-patent.wixsite.com/project-website/exhibitions

Organizer

Hong Kong Federation of Invention and Innovation
Phone:
+852 2268 6890
Email:
info@hkfii.org
Website:
http://hkfii.org/